Pattern of conductive traces laminated or printed on a flexible substrate.
Specialized in selectively applying polymers onto flexible substrates using precision screen printing.
Unlike subtractive processes, no materials are removed during production, for less waste and a greener design.
Crossovers or silver-through-hole technology enable an electrical connection between surfaces.
SMT components are mounted using conductive adhesive.
Simplicity in design results in a cost-competitive circuit technology.
We offer both single and multiple-layer flexible circuits, as well as thru-hole technology, depending on your application and needs.
Some applications require a smooth, continuous surface while others demand tactile feedback. That's where tactile and non-tactile domes come into play, which we concept and engineer for various applications.
Different circuit components require different spacing, or pitches, we advise on the best pitch for your needs, and offer 2.54, 1.27, 1.00, 0.5 (mm) pitch options
Depending on your application and needs, we also advise on different terminal and connector options, from zero insertion force (ZIF) connectors to connector and housing terminals
Flexible circuits can also be integrated into the chassis or aluminum panels of electronic devices. This integration involves mounting or attaching the flexible circuits to structural components.
Clear window or lens displays allow visibility into specific components, indicators, or displays beneath the flexible substrate.